LP8755 Datenblatt PDF

Teilenummer : LP8755

Function : Multi-Phase 6-Core Step-Down Converter / 49-Bump 0.4 mm Pitch DSBGA Package

Hersteller : Texas Instruments

Pinout :

LP8755 datenblatt

Beschreibung :

The LP8755 is designed to meet the power management requirements of the latest applications processors in mobile phones and similar portable applications. The device contains six step-down DC/DC converter cores, which are bundled together in a 6-phase buck converter. The device is fully controlled by a SmartReflex™-compatible interface or an I2C-compatible serial interface.

Datenblatt PDF Download

LP8755 pdf

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